xMEMS Active Micro-Cooling “Fan on a Chip” Named as CES Innovation Awards® 2025 Honoree

xMEMS Active Micro-Cooling “Fan on a Chip” Named as CES Innovation Awards^® 2025 Honoree

Media Contact:
Marta Majstorovic
Griffin360
marta@griffin360.com

The recently announced xMEMS XMC-2400 µCooling™ chip, the first-ever all-silicon, active micro-cooling air pump for small, thin electronics devices and next-generation artificial intelligence (AI) solutions, has been named a CES Innovation Awards^® 2025 Honoree in the best in computer hardware and components category.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20241114268094/en/

Source: xMEMS Labs, Inc.

The CES Innovation Awards program is an annual competition honoring outstanding design and engineering in 33 consumer technology product categories. The program received a record number of submissions – over 3,400. The announcement comes ahead of CES 2025, the world’s most powerful technology event, happening Jan. 7-10 in Las Vegas, NV.

The xMEMS XMC-2400 active micro-cooling (µCooling) chip allows manufacturers, for the first time, to integrate active cooling into smartphones, tablets, XR, smart glasses, cameras, SSDs, and other advanced mobile devices with a silent, vibration-free, solid-state chip that measures just 1-millimeter thin.

“We’re honored for our revolutionary XMC-2400 ‘fan-on-a-chip’ to be recognized by the CES Innovation Awards for the legitimate breakthrough that it is,” said Joseph Jiang, xMEMS CEO and Co-Founder. “Up until now, thermal management of thin, small form-factor electronics has been a massive challenge for manufacturers and consumers. XMC-2400 is poised to address those challenges and it comes at a critical moment in the industry – as ultramobile devices are running more processor-intensive AI applications.”

Measuring just 9.26 x 7.6 x 1.08 millimeters and weighing less than 150 milligrams, the XMC-2400 is 96 percent smaller and lighter than non-silicon-based, active-cooling alternatives. A single XMC-2400 chip can move up to 39 cubic centimeters of air per second with 1,000Pa of back pressure. The all-silicon solution offers semiconductor reliability, part-to-part uniformity, high robustness, and is IP58 rated.

xMEMS will be demonstrating the XMC-2400 at CES in The Venetian Suite 29-235 in Las Vegas January 7-10, 2025. Click here to schedule an appointment.

For more information about xMEMS and its ?Cooling solutions, visit xmems.com. For hi-res imagery, click here.

The CES Innovation Awards 2025 honorees, including product descriptions and photos, can be found at CES.tech/innovation. An elite panel of industry expert judges, including members of the media, designers, engineers, and more, reviewed submissions based on innovation, engineering and functionality, aesthetic, and design.

About xMEMS Labs, Inc.

Founded in January 2018, xMEMS Labs is the “X” factor in MEMS with the world’s most innovative piezoMEMS platform. It began by delivering the world’s first solid-state True MEMS speakers for TWS and other personal audio devices and evolved its substantial IP to produce the world’s first ?Cooling fan on a chip for smartphones and other thin, performance-oriented devices. xMEMS has over 200 granted patents worldwide for its technology. For more information, visit https://xmems.com.