KIOXIA Showcases PCIe 5.0 and EDSFF SSD Solutions at 2024 OCP Global Summit

KIOXIA Showcases PCIe 5.0 and EDSFF SSD Solutions at 2024 OCP Global Summit

Company Contact:
Mia Cool
KIOXIA America, Inc.
Tel: (408) 526-3087
mia.cool@kioxia.com

Media Contact:
Dena Jacobson
Lages & Associates
Tel: (949) 453-8080
dena@lages.com

the inventor of NAND flash memory, is at the Open Compute Project^® (OCP^®) Global Summit this week to highlight its extensive data center and enterprise solid state drive (SSD) portfolio. At the forefront will be the speed, scalability, and energy efficiency delivered by the company’s next-generation Enterprise and Datacenter Standard Form Factor (EDSFF) E1.S and PCIe^® 5.0 SSDs.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20241015677178/en/

The speed, scalability, and energy efficiency delivered by KIOXIA’s next-generation EDSFF E1.S and PCIe 5.0 SSDs will be at the forefront of KIOXIA’s OCP activities. (Graphic: Business Wire)

"KIOXIA continues to drive innovation within the open compute ecosystem,” said Neville Ichhaporia, senior vice president and general manager of the SSD business unit at KIOXIA America, Inc. “We ensure our solutions align with the evolving needs of hyperscale data centers, empowering enterprises to harness the expansive potential of open standards. By pushing the boundaries of performance and efficiency, our PCIe 5.0 and EDSFF SSD solutions are raising the bar for modern data infrastructures."

Product and technology demonstrations will be given in the KIOXIA booth #A7 on the show floor at the San Jose McEnery Convention Center from October 15-17.

Demonstrations include:

KIOXIA CD8P Series Data Center NVMe™ SSDs running AiSAQ ANN search to speed up AI applications.
New KIOXIA XD8 Series E1.S Data Center SSDs for hyperscale data center servers and storage.
Flexible Data Placement (FDP) demonstrating a reduction to SSD write amplification factor (WAF).
KIOXIA XD7P Series E1.S Data Center SSDs showing Live Migration to reduce data center down time and enable more effective load balancing without interrupting application workloads.

Additionally, Rory Bolt, senior fellow and principal architect for KIOXIA America, Inc. will be participating in the Flexible Data Placement discussion panel. Taking place on Wednesday, October 16 at 9:45 AM PT, this panel will explore FDP’s role in accelerating QLC adoption for data center/primary storage for AI applications. KIOXIA will also present an Expo Hall session titled, “How SSDs Enhance Vector Data Scaling in GenAI / RAG Systems,” on Thursday, October 17 at 10:05 AM PT.

For more information, please visit www.kioxia.com, and follow the company on X, formerly known as Twitter and LinkedIn^®.

About KIOXIA America, Inc.

KIOXIA America, Inc. is the U.S.-based subsidiary of KIOXIA Corporation, a leading worldwide supplier of flash memory and solid-state drives (SSDs). From the invention of flash memory to today’s breakthrough BiCS FLASH™ 3D technology, KIOXIA continues to pioneer innovative memory, SSD and software solutions that enrich people's lives and expand society's horizons. The company's innovative 3D flash memory technology, BiCS FLASH, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive, and data centers. For more information, please visit KIOXIA.com.

© 2024 KIOXIA America, Inc. All rights reserved. Information in this press release, including product pricing and specifications, content of services, and contact information is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable KIOXIA product specifications.

Notes:

OCP and OPEN COMPUTE PROJECT marks are owned by and used with the permission of the Open Compute Project Foundation.

The NVMe word mark is a registered or unregistered trademark or service mark of NVM Express, Inc. in the United States and other countries.

PCI Express and PCIe are registered trademarks of PCI-SIG.

LinkedIn is a trademark of LinkedIn Corporation and its affiliates in the United States and/or other countries.

All other company names, product names and service names may be trademarks of their respective companies.